Sharing project experiences, insights into cutting-edge architectures, focusing on cloud computing, microservices, big data, hyper-convergence, storage, data protection, artificial intelligence, industry practices and solutions.
After high‑level talks, the US cleared ten Chinese companies to buy Nvidia's H200 AI chip, but strict verification, revenue‑sharing, and volume limits led China to pause imports and boost domestic GPU development, reshaping market share and revenue expectations for both sides.
The article analyses how China’s AI chip industry confronts the 7nm process bottleneck by leveraging mature nodes, innovative architectures, chiplet packaging, high‑bandwidth memory and a growing software ecosystem, while projecting rapid market growth and outlining remaining technical gaps.
The article analyzes NVIDIA H200’s technical breakthroughs, compares it with Huawei’s Ascend 950, and explains how the H200’s market entry will both tighten NVIDIA’s short‑term dominance in China’s high‑end AI compute and spur long‑term advancements and competition among domestic chip makers.
This article presents a comprehensive 2026 design plan for an ultra‑large green AI data center with 5,000 cabinets, 150 MW IT load, and 200 MW capacity, detailing market drivers, core metrics, six design principles, site and power architecture, liquid‑cooling, networking, security, and AI‑driven autonomous operations.
Cerebras Systems’ Nasdaq debut on May 14, 2026 saw its shares jump from $350 to $385, a 108% surge that lifted its market value past $800 billion intraday and settled at a $669 billion valuation, while the company unveiled the world’s largest AI chip and secured multi‑billion‑dollar deals with OpenAI and AWS, signaling a serious challenge to Nvidia’s dominance in AI hardware.
The article reviews the US‑approved export of Nvidia's DGX H200, the lack of deliveries, Jensen Huang’s surprise China trip that may speed approvals, and then provides a detailed technical breakdown of the DGX H200 cluster’s compute and storage networking, topology, optical link choices, and cable count estimates.
During Trump’s May 13‑15 state visit to China, the White House announced a roster of leading US technology, finance, aviation and agriculture companies—highlighting AI as the central theme and underscoring the market barriers these firms face in China, with potential ripple effects across the global tech supply chain.
The article provides a detailed technical analysis of Huawei's Atlas 900A3 SuperPoD (CM384) supernode wiring architecture, covering cabinet composition, NPU/CPU counts, 400 G optical interconnect design, cable installation practices, scalability to 24 Pods, and the performance benefits for AI workloads.
The AI ecosystem is witnessing a massive shift where exploding hardware costs and soaring token demand have turned tokens into a high‑margin commodity, allowing model providers to capture most of the profit while Nvidia and TSMC keep prices flat for strategic reasons.
This article breaks down the seven types of chips—GPU/AI accelerators, CPUs, SoCs, MCUs, power semiconductors, network/interconnect chips, and storage chips—that together form the hardware backbone of modern AI data centers, explaining each component's role, key technologies, and why they must work in concert.
