Immersion Liquid Cooling Forum on AI Infrastructure: Key Insights and Industry Perspectives

On May 15, the "Immersion Liquid Cooling Intelligent Computing Industry Development Forum·AI Infra Advanced Cooling Seminar" was successfully held in Beijing, with experts from China Academy of Information and Communications Technology, Alibaba Cloud, OPPO, Intel, NVIDIA, AMD and others sharing topics on computing power and infrastructure cooling challenges under the rapid rise of AI large models. Alibaba Cloud senior technical manager Li Yue chaired the meeting.

Forum Executive Director and Alibaba Cloud Infrastructure Server R&D Director Wen Fangzhi gave a speech, stating that liquid cooling technology is the essential path to address AI infrastructure cooling pressure and energy‑saving challenges. The forum was established to unite liquid‑cooling industry forces, focusing on the current status and trends of immersion liquid cooling, advanced technologies, and application practices, promoting green development of AI infrastructure.

Theme Sharing

In the theme sharing session, Xie Lina, Deputy Director of the Data Center Department of the China Academy of Information and Communications Technology, introduced the current status and future trends of computing‑power infrastructure under the national policy background of "East Data West Computing"; Wang Wei, Alibaba Cloud Infrastructure Server Product Director, presented the current state of AI model development and analyzed the changing demands on AI Infra; OPPO AI computing architect Xia Zhongmou shared the design ideas of A100 training clusters, emphasizing the technical advantages of immersion liquid cooling AI clusters; Intel AI Solutions Architect Zhao Liang shared innovative solutions for large‑model computing based on Intel practice; Alibaba Cloud senior server R&D expert Zhong Yangfan introduced the next‑generation Pangu immersion liquid cooling server cluster design in response to increased chip power density; NVIDIA system SA manager Lu Chuan described the challenges large models pose to computing systems and illustrated the evolution of the NVIDIA DGX platform; AMD senior thermal structural engineer Cao Shiyu presented AMD's latest research on liquid cooling and shared practical cases.

Sub‑Forum

In the "AI Infrastructure Technical Solutions and Roadmap" sub‑forum, several experts presented advanced products or solutions. Wang Ping, Chief Architect of Denglin Technology, introduced innovative practices in immersion liquid cooling; Lei Zhigang, Deputy General Manager of Zhejiang Juhua Technology Center, shared research progress on new fluorine‑containing liquid‑cooling materials; Chen Aimin, Deputy General Manager of Zhejiang Noah and Vice Dean of the Electronic Materials Research Institute, introduced performance requirements of immersion liquid‑cooling materials and summarized efficient, eco‑friendly development ideas; Zhang Nan, senior thermal architect of Foxconn Industrial Internet, shared design considerations for immersion liquid‑cooling servers based on AI server development and the advantages of liquid cooling. In the round‑table discussion, senior experts from Alibaba Cloud, OPPO, JuXiang Technology, NVIDIA, and Yiqi Research Institute explored opportunities and challenges for sustainable AI Infra development.

At the meeting’s conclusion, experts discussed liquid‑cooling standards, specifications, and white‑paper projects. Alibaba Cloud senior technical experts Zhong Yangfan, Liu Dan, Lian Heng, Li Xiaopeng, engineer Tao Ling from Hangzhou Cloud Power Technology, and OPPO data‑center engineer Kong Qingyi introduced ten new project initiatives such as fluorinated liquid stability testing, mixed‑pressure PCB design verification, and oil‑based cooling liquid validation, officially launching the next phase of forum research.

Driven by AIGC applications such as ChatGPT 4.0, intelligent computing power will continue to expand rapidly, bringing significant cooling challenges alongside massive AI compute demand. Participants reached consensus that single‑phase immersion liquid cooling is one of the best solutions for current and future AI Infra cooling needs. The ODCC Immersion Liquid Cooling Intelligent Computing Industry Development Forum will closely monitor AI application innovation’s high‑energy and high‑density sustainability demands, focusing on frontier technologies and encouraging deeper industry collaboration.

↓↓ More exciting scenes ↓↓